Applicable process

product description: Applicable processFor semiconductor flip chip underfill, dam and fill, spot flux, solder paste and other processes.

Fabric:

model:

application:

TEL: 400-660-7690 turn 1

product description:

Applicable process

For semiconductor flip chip underfill, dam and fill, spot flux, solder paste and other processes.

Products / 相关产品 More

Guangdong Anda Automation Solutions Co., Ltd.

Address:No. 17, Xiangxidong District Road, Liaobu Town, Dongguan City, Guangdong Province

Friendly link:

Guangdong Public Network Security No. 44190002004553

Scan and follow Anda