NEPCON ASIA 2020 is a professional exhibition focusing on SMT and electronic manufacturing automation technology in the electronics manufacturing industry. As a high-quality exhibition for the electronics manufacturing industry in Asia, the annual NEPCON will stage a top feast in the electronics manufacturing field of the year.
As a leading expert in the field of industrial automation and intelligent modular assembly equipment in the country, Anda will bring the company's "star products" to the exhibition and share with you the "high-speed dispensing equipment" and "high-speed dispensing equipment" used in the SM process section of the 3C industry chain. "Intelligent selective coating overall solution".
NEPCON ASIA 2020 (Shenzhen) Electronic Equipment Exhibition
Booth number: 1D80
August 26-28, 2020
Hall 1, Shenzhen Convention and Exhibition Center, China
Wonderful presentation, we sincerely invite you to come!
Booth highlights
Application areas:
Underfill, FPC packaging, hot melt glue for mobile phone frame, SMT red glue, LED lens glue, IC edge packaging, etc.
ADG-5DI five-axis high-speed dispenser
Application range:
Hot melt glue, underfill, red glue, component package fixation, etc. for mobile phones and tablet devices
iCoat-5 Precision Coating Machine
Application range:
Selective coating of the front and back of the substrate, precise selective coating of components and pins, etc.
5DG-APR automatic plasma cleaning machine
(This thread body is independently developed by Anda)
Mobile phone automatic assembly line scheme
