This Adhesive Jetting 3D Printing solution delivers superior encapsulation  for electronics including PCBA and FPC.The technology precisely jets  UV-curable adhesive to form custom,high-strength 3D protective barriers  through multi-layer stacking, ensuring maximum reliability.

-Innovative Digital Packaging Process；

-High Precision: Edge definition ＜0.05mm, uniform coating coverage, sharp edge definition, and controllable thickness；

-Modular Printhead Assembly: Quick-change of different printhead assembly modules for various adhesive applications；

-Intelligent Printhead Maintenance: Optional adhesive drop observer function, machine vision for clog detection, automatic idle moisturizing & cleaning, and automatic printhead maintenance；

-Multi-Mode Programming: Supports import of Gerber, CAD, PDF, Image, STL 3D Model, PLY 3D Model, or online vision-guided 3D modeling to generate coating position information for 3D printing；

-Draw coating areas freely on the PCB image displayed by the vision system, or generate specified shapes on the image with support for arraying, rotating, flipping, mirroring, zooming in, zooming out and other operations for the shapes, and the equipment will print the edited shapes；

-Supports front/back printing, regional feature recognition and positioning printing, and Non-Contact High-Standoff printing；

-Integrated water-cooled UV curing lamp for immediate curing after printing, enabling high operation efficiency；

-Supports multi-Mark regional position correction；

-Optional independent adhesive circulation system；

-Optional AOI coating quality inspection。