• Plasma Systems: Core Technologies for Superior Semiconductor Manufacturing

• In chip manufacturing, surface cleaning and activation are critical first steps that determine the quality of all subsequent processes. Focusing on plasma technology, Andong Semiconductor's equipment platform has expanded to include applications like dry descum, covering both atmospheric and vacuum technical routes.

• 1. In-Line Atmospheric Plasma Series: AP-3P

• Built with a dedicated steel motion platform for stable and reliable operation.

• Supports a dual-head, dual-gun configuration, enabling simultaneous treatment of both sides of a product for dramatically improved throughput.

• Configurable with rotating plasma guns or pinpoint nozzles to significantly enhance surface wettability, create active surfaces, and improve material adhesion.

• 2. Vacuum Plasma Cleaning System: VP-10S

• Applied in integrated circuit packaging (lead frame cleaning), wire bonding, die bonding, and surface treatment before/after EMC molding.

• The VP series offers vacuum chamber volumes from 5L to 150L (including 10L, 60L, 80L, 100L), catering to both high-volume production and the processing of large-sized substrates.

• 3. Microwave Plasma Dry Descum Technology: MS-200

• Utilizes 2.45GHz high-frequency microwaves to generate high-density plasma, producing a large volume of highly active species.

• Enables highly efficient and precise photoresist stripping while minimizing damage to the underlying substrate.

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Process Value: In IC substrate manufacturing, plasma treatment not only cleans surfaces but also, through interface modification, significantly enhances the bonding strength between pads and packaging materials, laying a solid foundation for subsequent processes.

• As Chiplet technology and heterogeneous integration become industry standards, the dispensing process has evolved from simple adhesion to a pivotal process that determines package reliability.

• • Ultra-High Precision Positioning: The iJet-S10 achieves a repeatability accuracy of ±0.005mm with a maximum speed of 1300mm/s, ensuring a precise and stable dispensing path.
  • Flexible Configuration: The iJet-S8 offers both single-valve (X400×Y450×Z40) and dual-valve (X340×Y450×Z40) stroke configurations to adapt to different production line layouts.
  • Comprehensive Functions: Standard features include a vision recognition system, laser height sensor, and low-liquid-level detection. Options include a piezoelectric jet module, 3D dispensing, and four-direction tilt to meet complex process demands.
  • Intelligent Control System: Integrated vacuum cleaning and an audible/visual alarm system ensure long-term stable operation.

Andong Semiconductor's technical strength lies in providing a complete process chain for semiconductor manufacturing:

• Surface Treatment & Interface Engineering: Plasma cleaning not only removes contaminants but also creates an ideal bonding interface through surface activation.
• Precision Bonding & Encapsulation: Intelligent dispensing enables micron-level precision coating, ensuring the mechanical strength and thermal performance of chip structures.
• Process Adaptability & Flexible Manufacturing: Modular design supports rapid line changeovers, meeting the high-mix, low-volume production needs of the semiconductor industry.

This integrated technology chain demonstrates significant value in manufacturing power devices, sensors, and RF chips, helping customers enhance product reliability while optimizing manufacturing costs.

Advances in semiconductor manufacturing rely on the continuous innovation of dedicated equipment. Leveraging deep expertise in plasma technology and precision fluid control, Andong Semiconductor provides systematic process equipment solutions—from surface treatment to precision encapsulation—for the semiconductor industry.